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          Automotive Electronics

          ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

          AD8312 Plus Series

          Automatic Die Bonding System (12” wafer handling)

          Eagle AERO

          For High-end IC Applications


          eClip Plus Series

          Automatic Clip Bonding System

          FIREBIRD TCB Series

          Automatic Thermal Compression Bonding System

          Ultrasonic Wedge Bonder


          Heavy Aluminum Wire Bonding System

          Transfer Molding

          IDEALmold? 3G

          Automatic Encapsulation Solution (strip / reel form substrate handling)


          Automatic Die Bonding System (12” wafer handling)

          MP-TAB Series

          Automatic Trim & Form System

          NUCLEUS Series / NUCLEUS-XL Series

          Multi-Purpose Precision Pick & Place Tool

          20 Pickheads System


          Fully Automatic Turret Sorting Handler


          Automatic Die Bonding System (8” wafer handling)

          Laser 1205

          UV Grooving System

          Other Applications