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          MEMs

          ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

          AD8312 Plus Series

          Automatic Die Bonding System (12” wafer handling)

          Eagle AERO

          For High-end IC Applications

          Transfer Molding

          IDEALmold? 3G

          Automatic Encapsulation Solution (strip / reel form substrate handling)

          Transfer Molding Compression Molding

          ORCAS Manual

          Manual Encapsulation Solution

          Compression Molding

          ORCAS Series

          Encapsulation Solution for Large Format Packaging

          Ball Bonder IC Wire Bonding Equipment

          Eagle Xpress GoCu

          High Speed Wire Bonder for Wider Substrate

          Special Wire Bonding Equipment

          Eagle Xpress GoCu with Automated Conveyor System

          High Speed Wire Bonder for Inline Configuration

          Ball Bonder OPTO/LED Wire Bonding Equipment

          Harrier Xtreme

          Dual-Head Extreme High Speed Wire Bonder

          Compression Molding

          IDEALcompress?

          Automatic Encapsulation Solution (strip form substrate handling)

          Transfer Molding

          IDEALmold? R2R

          Encapsulation Solution

          Ball Bonder IC Wire Bonding Equipment

          iHawk Xpress Gocu

          Wire Bonder

          OPTO/LED Wire Bonding Equipment

          iHawk Xpress XL

          Wire Bonder

          Other Applications

          国产一级毛卡片视频app